固化是指在電子行業(yè)及其它各種行業(yè)中，為了增強材料結合的應力而采用的零部件加熱、樹脂固化和烘干的生產(chǎn)工藝。實施固化的容器即為固化爐。
Curing refers to the production process of heating components, resin curing, and drying adopted in the electronics industry and various other industries to enhance the stress of material bonding. The container used for implementing curing is known as a curing oven.
固化是指在電子行業(yè)及其它各種行業(yè)中，為了增強材料結合的應力而采用的零部件加熱、樹脂固化和烘干的生產(chǎn)工藝。實施固化的容器即為固化爐。 Curing refers to the production process of heating components, resin curing, and drying adopted in the electronics industry and various other industries to enhance the stress of material bonding. The container used for implementing curing is known as a curing oven.
序號 S/N | 型號 Model | 加熱功率Heating Power（kW） | 溫度均勻度 Temperature Uniformity (±%) | 溫度波動度 Temperature Fluctuation (±℃) | 工作室mm （寬*深*高） Work Chamber mm (W*D*H) | 工作溫度 Work Temperature (℃) | 電源 Power Supply |
1 | HW-CO-25162020 | 52 | ±3% | ±2℃ | 1600*2000*2000 | RT+20℃~+250℃ | 三相380V 50HZ |
2 | HW-CO-25202020 | 60 | ±3% | ±2℃ | 2000*2000*2000 | ||
3 | HW-CO-25202520 | 66 | ±3% | ±2℃ | 2000*2500*2000 | ||
4 | HW-CO-25203020 | 72 | ±3% | ±2℃ | 2000*3000*2000 | ||
5 | HW-CO-25204020 | 90 | ±3% | ±2℃ | 2000*4000*2000 | ||
6 | HW-CO-25303025 | 108 | ±3% | ±2℃ | 3000*3000*2500 | ||
7 | HW-CO-25304025 | 132 | ±3% | ±2℃ | 3000*4000*2500 | ||
8 | HW-CO-25355030 | 180 | ±3% | ±2℃ | 3500*5000*3000 | ||
9 | HW-CO-25358030 | 336 | ±3% | ±2℃ | 3500*8000*3000 |